增韧-铜锌合金.pdfVIP

APPLIED PHYSICS LETTERS 92, 081903 2008 Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density Y. H. Zhao,1,6,a J. F. Bingert,1 Y. T. Zhu,1,b X. Z. Liao,2 R. Z. Valiev,3 Z. Horita,4 T. G. Langdon,5 Y. Z. Zhou,6 and E. J. Lavernia6 1 Los Alamos National Laboratory, Los Alamos, New Mexico 87545, USA 2 School of Aerospace, Mechanical and Mechatronic Engineering, The University of Sydney, Sydney, New South Wales 2006, Australia 3 Institute of Physics of Advanced Materials, Ufa State Aviation Technical University, Ufa 450000, Russia 4 Department of Materials Science and Engineering, Kyushu University, Fukuoka 819-0395, Japan 5 Departments of Aerospace and Mechanical Engineering and Materials Science, University of Southern California, Los Angeles, California 90089-1453, USA 6 Department of Chemical Engineering and Materials Science, University of California, Davis, California 95616, USA Received 25 November 2007; accepted 25 January 2008; published online 25 February 2008 Although there are a few isolated examples of excellent strength and ductility in single-phase metals with ultrafine grained UFG structures, the precise role of different microstructural features responsible for these results is not fully understood. Here, we demonstrate that a large fraction of high-angle grain boundaries and a low dislocation density may significantly improve the toughness and uniform elongation of UFG Cu by increasing its strain-hardening rate without any concomitant sacrifice in its yield strength. Our study provides a strategy for synthesizing tough UFG materials.