电容式TP前段制程教材PhotoEtching process introduction922概要1.pptVIP

Photo/Etching 製程簡介 蝕刻目的: 經過顯影后的基板,利用相對應的化學試劑將裸露在表面的材料移除掉,以達到設計需求的pattern. 蝕刻輪廓: Stripper目的: 將未被曝過光的光阻移除掉,從而得出設計所需要的pattern. Stripper 原理: Confidential TFTTPD/ENG/PEN Outline : Photo/Etching Process Flow Photo基本製程原理 Etching基本製程原理 Double side ITO Sputter ---B line Touch panel 電容段製造流程 Glass ITO SiO2 PF ITO Metal SiO2 Organic PF Sensor Side Drive Side Drive side ITO Photo/Etch ---D line Sensor side ITO Photo/Etch ---E line Drive side metal Sputter ---A line Drive side metal Photo/Etch--- C line Double side SiO2 Sputter ----F line Double side SiO2 Etch ----G line Drive side Organ