Hillock formation during electromigration in Cu （丘在铜电迁移形成）.pdfVIP

Hillock formation during electromigration in Cu and Al thin films: Three-dimensional grain growth A. Gladkikh and Y. Lereah Department of Electronic Devices and Materials, Tel Aviv University, Ramat Aviv, Israel 69978 E. Glickman Graduate School of Applied Science and Technology, The Hebrew University, Jerusalem, Israel 91904 M. Karpovskia) and A. Palevski School of Physics and Astronomy, Tel Aviv University, Ramat Aviv, Israel 69978 J. Schubert Intel, Jerusalem, Israel 91031 Received 18