以有机酸气氛进行铜表面及铜微粒子还原之研究Reductionof-YOKE.PDF

以有機酸氣氛進行銅表面及銅微粒子還原之研究 Reduction of Copper Surface and Submicron Particles With Organic Acid vapor * 郭家真 陳姵希 吳嘉信 宋振銘 Chia-Chen Kuo Pei-Hsi Chen Chia-Hsin Wu Jenn-Ming Song 國立中興大學材料科學與工程學系 摘要 銅因具優良導電、導熱性質以及加工容易等諸多優點，在微電子線路及構裝方面應用甚廣， 但由於銅表面極易氧化，造成製程與使用上的限制，故如何 潔淨銅表面一直是項重要課題；此 外 ，金屬微粒具高比表面積，因此經低溫燒結即可獲得優良導電體。與貴重金屬(金、銀等) 相 較，銅微粒成本相對低廉許多，但亦因其易氧化性造成應用與儲存上的困難。本研究開發以 有 o 機酸氣氛還原氧化亞 銅，在低溫 (250 C) 、短時間(30 分鐘內)即可將約 100nm之氧化亞銅還 原完畢。通氣氛同時搭配一低沸點溶劑，亦可在低溫短時間將市售氧化銅氧化亞銅微粒還原/ 成散佈性佳之純銅粒子。此外，本研究使用原位 (in situ) 傅立葉轉換光譜儀 (FTIR)觀測有機 酸氣氛與經氧化之銅表面於不同持溫溫度下反應行為，除進行氧化亞銅還原動力學解析之外， 亦提出有機酸官能基與金屬表面氧化物間作用機制。 關鍵詞 ：銅、甲酸、表面改質、FTIR Abstract The combination of excellent electrical and thermal conductivity properties makes copper a good selection for interconnect materials and package. Because the copper surface is easily oxidized, it cause the limit for manufacture. So how to clean copper surface has been importantly topics. Besides, taking the advantage of the drastically reduced sintering temperature of nano-sized particles (NPs), copper NPs attract considerable attention and have been regarded as a promising material for circuit fabrication. Compared with nobleness metal (Au,Ag) , Cu possesses cheaper prices. However, rapid oxidation of Cu NPs is a fatal demerit. In order to clean the copper surface, We are developed to reduce the copper oxide with organic acid vapor in this study. From the experiment results, A low temperature two-phase reduction method has been successfully developed, which can transform o copper oxide particles to copper particles efficiently (at 25