助焊剂活性物质的制备与研究 preparation and study on active substance of soldering flux.pdfVIP

第 期 电 子 元 件 与 材 料 3 Vol.25 No.3 年 月 ELECTRONIC COMPONENTS MATERIALS 2006 3 Mar. 2006 研究与试制研究与试制 研究与试制研究与试制 R D 助焊剂活性物质的制备与研究 王伟科 赵麦群 王娅辉 邬 涛 摘要:16 pH 6 IMC 关键词: 中图分类号: TN604 文献标识码:A 文章编号:1001-2028 2006 03-0033-04 Preparation and Study on Active Substance of Soldering Flux WANG Wei-ke, ZHAO Mai-qun, WANG Ya-hui, WU Tao (School of Materials Sci and Eng, Xian University of Technology, Xian 710048, China) Abstract: The properties of 16 kinds of organic activator were tested by means of witting angle and spreading property. The thermal decomposition process of activator was tested by TGA. Compounding the selected active substance, and then it was coated. The results show that the citric acid and malic acid can be met the requirement and triethanalamine can be adjusted the acidity of the flux. Polymethacrylates are used as materials of the encapsulation wall of micro capsule in active substance. The compound of active substance after micro encapsulation treatment can be dissolved in organic solvent and its pH value is near to 6. The jointing properties of the flux made by it are perfect and the IMC is thin and transparent. Key words: electronic technology; contact angle; spreading property; TG; activator; micro encapsulation 理想的焊接要求活性物质在焊料熔化前可将焊料 提出一套较为理想的选取和处理方法 和金属基板上的氧化物去除或者还原 促进焊料的润 1 实验仪器及方法 湿 保证焊料熔化后两种新鲜的金属可以直接接触 从而顺利的完成焊接 焊接完成后要求其残留物可以 1.1 润湿性与腐蚀性的测量 完全挥发或者活性大为降低 在大气环境下保持惰性 符合GB5231 的紫