sers substrates by the assembly of silver nanocubes high-throughput and enhancement reliability considerationsser的组装基板银nanocubes高通量和增强可靠性方面的考虑.pdfVIP

Hindawi Publishing Corporation Journal of Nanotechnology Volume 2012, Article ID 870378, 12 pages doi:10.1155/2012/870378 Research Article SERS Substrates by the Assembly of Silver Nanocubes: High-Throughput and Enhancement Reliability Considerations Oded Rabin1, 2 and Seung Yong Lee1 1 Department of Materials Science and Engineering, University of Maryland, College Park, MD 20742, USA 2 Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, MD 20742, USA Correspondence should be addressed to Oded