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Strength and Lifetime Analysis of SMT Solder （强度和寿命分析SMT焊接）
Proceedings, SMI ‘97, San Jose, CA, September 7-11, Best Paper award, second prize
Strength and Lifetime Analysis of SMT Solder Joints:
An Exemplary Study of the MiniMELF Component
J. Jendrny, W.H. Müller, Universität-Gesamthochschule Paderborn, and
H.-J. Albrecht, Siemens AG, ZT ME 7, Berlin
ABSTRACT gested and will be demonstrated for a real SMT-structure,
The reliability and lifetime of SMT solder joints obtained the “MiniMelf” (metal-elektrode-facing) resistor:
by reflow or wave soldering are investigated for the case
of an electronic miniature resistor. Life-limiting issues The first step consists of a non-linear three-dimensional
addressed in this paper include irreversible deformation finite element (FE) analysis of the thermally loaded struc-
due to plasticity and creep, faulty positioning of the mi- ture. In the present case the thermal loading follows the
cro-electronic component, and a discussion of the influ- requirements of military specification Mil-Std-883,
ence of processing techniques (reflow vs. wave solder- method 1011, condition B [1] and consists of thermal
ing). The study decisively relies on a three-dimensional, cycling between +125°C and -55°C, as shown in Figure 1.
non-linear finite element (FE) analysis, the results of
which are used as input to various damage models. The A detailed discretization of a wave as well as a reflow
analytical prediction of lifetime is finally compared with soldered structure is performed in a semi-automated fash-
experiments in order to prepare its transfer to real
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