电子封装用al-50%sic复合材料的组织和性能 microstructures and properties of al-50%sic composites for electronic packaging applications.pdfVIP

Trans. Nonferrous Met. Soc. China 26(2016) 2647−2652 Microstructures and properties of Al−50%SiC composites for electronic packaging applications 1,2 1,2 1 1 1 2 2 Fei TENG , Kun YU , Jie LUO , Hong-jie FANG , Chun-li SHI , Yi-long DAI , Han-qing XIONG 1. Department of Materials Science and Engineering, Yantai Nanshan University, Yantai 265713, China; 2. School of Materials Science and Engineering, Central South University, Changsha 410083, China Received 30 September 2015; accepted 6 April 2016 Abstract: Al−50%SiC (volume fraction) composites containing different sizes of SiC particles (average sizes of 23, 38 and 75 μm) were prepared by powder metallurgy. The influences of SiC particle sizes and annealing on the properties of the composites were investigated. The results show that SiC particles are distributed uniformly in the Al matrix. The coarse SiC particles result in higher coefficient of thermal expansion (CTE) and higher thermal conductivity (TC), while fine SiC particles decrease CTE and improve flexural strength of the composites. The morphology and size of SiC particles in the composite are not influenced by the annealing treatment at 400 °C for 6 h. However, the CTE and the flexural strength of annealed composites are decreased slightly, and the TC is improved. The TC, CTE and flexural strength of the Al/SiC composite with average SiC particle size of 75 μm are 156 W/(m·K), −6 − 1 11.6×10 K and 229 MPa, respectively. Key words: Al−50%SiC composites; powder metallurgy; thermal properties; flexural strength; electronic packaging material