产品外观检验规范讲议.pptVIP

理想狀況(TARGET CONDITION) DIP2-7 零件組裝標準--機構零件﹝CPU SLOT﹞浮高、傾斜(次缺-Minor) 允收狀況(ACCEPTABLE CONDITION) Lh .Wh≦ 0.5mm 拒收狀況(NONCONFORMING DEFECT) Lh .Wh 0.5mm DIP 外 觀 檢 驗 規 範 PAGE 7 1. 機構零件基座平貼PCB零件面 ，無浮高傾斜現象。 Component is mounted on M/B closely and no floating phenomenon.. 1.傾斜、浮高高度小於0.5mm內 。( Lh .Wh≦ 0.5mm ) 2.錫面零件腳出孔 1.Lh .Wh is less than 0.5mm. 2.Lead is protruded over solder. 1. 傾斜、浮高高度大於0.5mm， 判定拒收。( Lh .Wh 0. 5mm ) 2. 錫面零件腳未出孔判定拒收。 1.Lh .Wh is over than 0.5mm. 2.Lead isn’t protruded over solder. PCB SLOT1 理想狀況(TARGET CONDITION) DIP2-8 零件組裝標準--機構零件﹝JUMPER PINS﹞浮件、傾斜(次缺-Minor) 允收狀況(ACCEPTABLE CONDITION) Lh.Wh ≦2.0mm DIP 外 觀 檢 驗 規 範 拒收狀況(NONCONFORMING DEFECT) PAGE 8 Lh . Wh 2.0mm 1. 零件平貼於PCB零件面。 2. 無傾斜、浮件現象。 1.Component is mounted on M/B closely. 2.No tilt or floating phenomenon. 1. 浮高、傾斜小於2.0mm。 ( Lh .Wh≦ 2.0mm ) 2.錫面零件腳出孔 3.排針頂端最大傾斜不得超過 PCB板邊邊緣 4.傾斜不得觸及其他零件 1.Lh . Wh is less than 2.0mm 2.Lead is protruded over solder. 3.If pin tilt, the tilt pin can’t over the edge of PCB or contact other component. 1. 浮高、傾斜大於2.0mm判定拒收。( Lh .Wh 2.0mm ) 2. 錫面零件腳未出孔判定拒收。 3.排針頂端最大傾斜超過PCB板 邊邊緣。 4.傾斜觸及其他零件。 1.Lh . Wh over than 2.0mm. 2.Lead isn’t protruded over solder. 3.The tilt pin can’t over the PCB edge or contact other component. PCB 理想狀況(TARGET CONDITION) DIP2-9 零件組裝標準--機構零件﹝JUMPER PINS﹞組裝性(次缺Minor) 允收狀況(ACCEPTABLE CONDITION) DIP 外 觀 檢 驗 規 範 PAGE 9 1. PIN排列直立 2. 無PIN歪與變形不良。 1.Pin is straight. 2.Pin surface is luminous and no bur is appeared. 1. PIN( 撞 )歪小於1/2 PIN的厚 度，判定允收。 2. PIN高低誤差小於0.5mm內 判定允收。 1.Dimension P is less than ? thickness of pin. 2.Dimension H is less than 0.5mm. 1. PIN( 撞 )歪大於 1/2 PIN的厚 度，判定拒收。 2. PIN高低誤差大於0.5mm外， 判定拒收。 1.Dimension P is greater than ? thickness of pin. 2.Dimension H is greater than 0.5mm. PIN高低誤差 (H) ≦ 0.5mm PIN歪(P) ≦1/2 PIN厚度 拒收狀況(NONCONFORMING DEFECT) PIN高低誤差(H) 0.5mm PIN歪(P)1/2 PIN厚度 P H H P PCB DIP2-10 零件組裝標準--機構零件﹝JUMPER PINS﹞組裝外觀(次缺-Minor