pcb的质量问题对三种工艺装配质量的影响（The effect of PCB quality on assembly quality of three processes）.docVIP

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pcb的质量问题对三种工艺装配质量的影响（The effect of PCB quality on assembly quality of three processes）.doc

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pcb的质量问题对三种工艺装配质量的影响（The effect of PCB quality on assembly quality of three processes）

pcb的质量问题对三种工艺装配质量的影响（The effect of PCB quality on assembly quality of three processes） PCB production after the production, but also need to put the components assembled, in order to further delivery. Assembly is the most common method, wave soldering, reflow and two mixed technology. The quality of PCB has a great influence on the assembly quality of the three processes. 1. wave soldering 1.1 introduction to wave soldering process: Wave soldering refers to the solder melting (Pb Sn alloy), the electric pump or the electromagnetic pump jet into the solder wave design requirements, the printed circuit board is equipped with pre components through the solder wave, components welding end or printed soldering pins and the mechanical and electrical connection between the board. 1.2 introduction of wave soldering process Insert components into the holes of the corresponding components. Pre coated flux, pre drying (temperature 90-1000C, length 1-1.2m), wave soldering (220-2400C), removal of excess plug, foot check. Effect of 1.3PCB quality on wave soldering process The 1.3.1 element has a green hole, which results in poor tin in the hole. Need to insert parts PTH, holes are not allowed inside the green ring, or when the tin stove can lead tin along the hole wall smooth leaching, lead to the hole on the tin is not full, so PCB element hole green should not exceed 10% of the area of the hole wall. And the whole board contains green, the number of holes should not exceed 5%. 1.3.2 hole wall coating thickness is not enough, lead to tin in hole is not good. Hole wall thickness of coating elements such as copper, tin, gold, thick thick thickness, ENTEK thickness is thin, will lead to tin not full (a customer called the navel phenomenon) or bubble. Therefore, under normal circumstances, the hole wall copper thickness should be more than 18 mu m. Tin thickness shall be above 100 mu. Rough 1.3.3 hole wall is large, resulting in poor or tin. The roughness of the hole wall is large,