电镀不良分析（Plating defect analysis）.doc

电镀不良分析（Plating defect analysis） Smaller part Before treatment in order to get a good coating, because the PCB processing board in the process before and during handling and preservation with grease, glue mark, oxidation, dust and dirt on the surface and, if not remove the dirt and plating may cause uneven gloss of coating. Therefore, in the actual production process, copper plate will be worn before grinding, degreasing and pickling. Control the pH of the copper solution to avoid too fast reaction, which will make the chemical copper very rough. 2, micro etching liquid copper ion can not be high, and wash to be sufficient. 3 cleaning with tap water and DI water hardness is too high will also make copper surface rough and copper particles, water treatment should be done (water hardness and conductivity) When the copper circuit board surface low current region dull phenomenon, the low concentration of chlorine prescription; by adding hydrochloric acid, low surface current density region of coating dull phenomenon can disappear, plating of chloride ion concentration in the liquid can reach the normal range, the surface layer of bright plating. If we need to add a large number of hydrochloric acid to solve the low current density zone coating matte phenomenon, it is not necessarily the chloride concentration is too low, resulting in the need to analyze the real reason. If a large amount of hydrochloric acid is added, other consequences may occur, and secondly, increasing production costs is not conducive to enterprise competition. To eliminate the low current density, coating light phenomenon by adding large amounts of hydrochloric acid, that is the chlorine ion is too small, only need to add hydrochloric acid to increase the concentration of chloride ions reached the normal range, the low current density region of light coating. Usually coarsely white 2. foreign body: refers to the surface of the terminal attached to the dirt 3., the tightness of bad: refers to the coa