电镀不良分析（Plating defect analysis）.docVIP

电镀不良分析（Plating defect analysis） Smaller part Before treatment in order to get a good coating, because the PCB processing board in the process before and during handling and preservation with grease, glue mark, oxidation, dust and dirt on the surface and, if not remove the dirt and plating may cause uneven gloss of coating. Therefore, in the actual production process, copper plate will be worn before grinding, degreasing and pickling. Control the pH of the copper solution to avoid too fast reaction, which will make the chemical copper very rough. 2, micro etching liquid copper ion can not be hi