盲埋孔板制作案例细节描术（Detail description of blind hole plate fabrication）.docVIP

盲埋孔板制作案例细节描术（Detail description of blind hole plate fabrication） A blind hole plate, with a minimum width of 0.12mm, a minimum aperture of 0.25mm, and a finished board thickness of 1.6mm. This board is a long distance interphone board exported to the United States after installation. In the blind hole production and processing should be a certain representation. First, the line relationship of this model board: This is a six board, the board of each layer of line correlation is relatively complex of a walkie talkie board. The following relation between each layer: the first, second layer connected. There is a drill file, which is equivalent to making a double sided board at the time of making. Core board requirements: 0.35mm, 0.5OZ, fourth, fifth layers of copper foil; first inner layer as inner layer third, sixth layer. Core board requirements: 0.3mm, 0.5OZ, third, sixth layers of copper foil; there is a file, the equivalent of third to sixth layer is a four layer line connectivity. The thickness of the third, sixth layer is 0.6mm, and the laminated copper foil is 0.5OZ. The first, sixth layer of a file, including component surface and welding surface connectivity. The minimum inner diameter of the inner layer is 0.3mm, the minimum line width is 0.125mm, and the outer minimum aperture is 0.25mm (referring to the product aperture), and the minimum width is 0.125mm. Delivery is 1 * 4, and only fully qualified board delivery is accepted. Two, the process needs to control the links and processes: The control points that need to be noted are required to control the control processes The three drilling must ensure that each drill hole once, and ensure that the associated lines correct line. Engineering drilling design documents, drilling procedures The two lamination guarantees the interlayer alignment of each layer. Besides the engineering design, the graphic transfer process is also controlled Three graphics transfer, should control the film expansion coefficient, engi