确保信号完整性的高速pcb电路板设计准则(Design criteria for high speed PCB circuit boards to ensure signal integrity).doc

确保信号完整性的高速pcb电路板设计准则(Design criteria for high speed PCB circuit boards to ensure signal integrity).doc

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确保信号完整性的高速pcb电路板设计准则(Design criteria for high speed PCB circuit boards to ensure signal integrity)

确保信号完整性的高速pcb电路板设计准则(Design criteria for high speed PCB circuit boards to ensure signal integrity) DOC documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view. Design criteria for high speed PCB circuit boards to ensure signal integrity (2) After wiring, SI simulation, in general, SI design guidance rules, it is difficult to ensure that after the actual wiring is completed, there is no SI or timing problems. Even if the design is carried out under the guidance of the guide, unless you can continue to automatically check the design, otherwise there is no guarantee that the design fully comply with the guidelines, and therefore inevitably problems. After the wiring, the SI simulation check will allow for a planned break (or change) design rule, but this is only necessary for cost considerations or tight wiring requirements. Now, using the SI simulation engine, it is possible to emulate high-speed digital PCB (even multi board systems), automatically block the SI problem, and generate accurate pin to pin delay parameters. As long as the input signal is good enough, the simulation results will be equally good. This makes the accuracy of the device model and circuit board manufacturing parameters a key factor in determining the simulation results. Many design engineers will emulate the minimum and maximum design corners, and then use the relevant information to solve problems and adjust productivity. After the manufacturing stage of the above measures can ensure the quality of the SI design of the circuit board, the circuit board assembly is completed, it is still necessary to the circuit board on the test platform, using oscilloscope or TDR (time domain reflectometry) measurement, the real circuit board and the simulation results were compared with the expected. These measurements can help you improve the model and manufacturing parameters so that you can make better (less constra

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