操作培训教材1（Operation training materials 1）.docVIP

操作培训教材1（Operation training materials 1） SMT operation training materials Preface The concept and development of SMT. SMT: surface mount technology. The fourth generation PCB assembly technology has the characteristics of high digitalization and modernization of manufacturing process. Production requirements. In the twenty-first Century, with the rapid development of information technology, the life cycle of electronic products is getting shorter and shorter, and the speed of updating is obviously accelerated, The electronic manufacturing industry is faced with a multi model, small batch production environment. Therefore, SMT as a new generation of electronic assembly technology, but also toward high efficiency, Flexible and intelligent development, in order to meet the needs of multi-user, multi tasking, multi model production. History of SMT development. Development order: When the plug and mount (mixed) mixed, produced the dispensing process. (common use of epoxy resin) * reflux curing Full SMT mount produces printing paste process. (tin lead alloy) * reflux curing Solder paste production process: 90% metal component, point on the pad on the PCB. The process is cured by reflux Production process. 1, mixed AI and SMT. 2, all SMT process. Single side: (typical) Double sides: (first, light material, second sides with other components) * Note: reflow soldering of the first temperature solder paste The second sides should be affixed with larger IC, using low temperature solder paste, reflux curing Component naming. 3, SMD: name the element by outline. CHIP component: Metric 3216212516081005 0603 British system 1206080406030402 0201 IC component: DIP, SOP, QFP, BGA, CSP, PLCC, LCC The pin is inserted on both sides of a foot foot piece bottom edges are feet (spherical) thin side foot pin bends * QFP: packaging technology. 32mm max, 0.5P. Chapter 1 Safety precautions: 1. the machine operation is carried out by one person in principle. If the execution is performed by more