倒装焊与芯片级封装技术的研究（PPT10页）.pptVIP

倒裝焊与晶片級封裝技術的研究 Why Flip Chip? Better manufacturing yield than wirebond for high pin-count chips. 對于高密度引腳芯片，成品率优于丝键合。 Faster manufacturing through-put than wirebond for high pin-count chips. 對于高密度引腳芯片，生产效率高于丝键合。 More reliability than wirebonded chips. 可靠性优于丝键合封装芯片。 Better electrical characteristics (less inductance) for high-speed chips. A must for RF, optoelectronics, high-speed digital (500MHz). 对于高速芯片，具有良好的电学性能。 More on Why Flip Chip? Desirable for high-performance Ball Grid Array (BGA) package. 高性能球形焊点阵列封装需要倒装焊。 Desirable for Chip Size Package (CSP). 芯片尺寸封装技术需要倒装焊。 The Flipchip b