利用RGA残余气体分析仪进行真空过程气体表征.pdfVIP

Residual Gas Analysis for Process PROCESS GAS ANALYSERS Characterisation HPR-30 APPLICATION NOTES In order to fully characterise a plasma process it is important firstly to identify each of the critical processing steps. These may include high vacuum preparation, backfill with reagent gases, processing step and finally post processing pump down. In each of these stages Hiden’s HPR-30 Series provides the diagnostic and data handling capability to ensure key information is routinely measured, logged and interrogated. The measurements described in this note were carried out using an HPR-30 Series instrument to monitor the various processing steps during a wafer device etching stage. _______________________________________________________________________________________ Step 1: Base Pressure Residual Gas Analysis With the process tool under vacuum a fingerprint of chamber is required. the residual gas composition the residual gases using the integral “RGA” facility can have a significant impact on the process plasma is obtained. This will reveal the composition of base composition and therefore the gases should be pressure components such as hydrogen, water and identified and compared from run to run. In nitrogen. These initial measurements will indicate addition, the integrity of for instance, gas feed lines whether there are any issues to be addressed, such as can be checked by taking a series of RGA locating the source of an air leak or if a bakeout fingerprints with different parts of the tool isolated cycle on the from the mass spectrometer. Figure 1: Base Pressure Residual Gas