教案无铅焊锡丝的使用介绍.pptVIP

* The failure mechanism cannot be avoided and is a “natural” failure mode. Basically all forms of plating have minute surface defects. These take the form of small surface cracks, inclusions or stress regions. * Once the molten solder has penetrated through the iron plating, rapid dissolution of the copper core takes place and the tip finally fails. This is caused the defect propagation phase and represents approximately 10% of the total time to failure * Once the molten solder has penetrated through the iron plating, rapid dissolution of the copper core takes place and the tip finally fails. This is caused the defect propagation phase and represents approximately 10% of the total time to failure * Introductory Statement: Pb Free with it’s higher processing temperatures exacerbates these factors Notes: Fe dissolution failures are rarely observed since de-wetting will be the initial symptom and will typically impact the continued use of the tip without some form or remediation Lead free applications may require higher tip temperatures to support the same through-put as leaded applications (some doubt that same throughput is acahieabel with current SAC alloys). The elevated tip temperatures will significantly impact tip life and therefore tip care procedures have even higher value. In general, it is possible to execute a lead free junction at the same tip idle temperature as leaded junctions – keep in mind that throughput will be impacted. However, customers should first consider alternate tip geometries before increasing the idle tip temperature. Given the reduced thermal resistance demands (heater to tip resistance) associated with lead free applications an increase in Fe plating thickness as a solution to extending tip life will be counterproductive to meeting the thermal requirements of the application Note that frequent tip tinning to prevent organic residue will promote Fe contamination (Intermetallic formation) in the short term and Fe Dissolution in the