晶圆级芯片尺寸封装柔性焊点热循环可靠性.docx

櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶櫶DOI:10．13290/j．cnki．bdtjs．2014．08．013晶圆级芯片尺寸封装柔性焊点热循环可靠性梁颖1，黄春跃2，熊国际2，张欣1，李天明3，吴松2，郭广阔2(1.成都航空职业技术学院电子工程系，成都610021;2.桂林电子科技大学机电工程学院，广西桂林541004;3.桂林航天工业学院汽车与动力工程系，广西桂林541004)16摘要: 建立了晶圆级芯片尺寸封装 ( WLCSP)柔性无铅焊点三维有限元分析模型，基于该模型对柔性无铅焊点热循环等效应力应变进行了分析，并预测了焊点可靠性寿命。选取第一柔性层厚度、第二柔性层厚度、上焊盘直径和下焊盘直径作为关键因素，采用L(45)正交设计了16种不同水平组合的柔性无铅焊点，获取了这些焊点的热循环等效应力数据，对等效应力数据进行了极差分析和方差分析。结果表明: 在热循环加载条件下，采用柔性层结构方式能有效降低焊点内的等效应力应变; 在置信度为 90% 的情况下，下焊盘直径和第一柔性层厚度对柔性焊点等效应力有显著影响。各因素对焊点等效应力的影响排序为下焊盘直径影响最大，其次是第一柔性层厚度，再次是第二柔性层厚度，最后是上焊盘直径。关键词: 柔性无铅焊点; 应力应变; 热疲劳寿命; 有限元分析; 极差分析; 方差分析中图分类号: TN305.94文献标识码: A文章编号: 1003－353X (2014) 08－0621－08Ｒeliability of Solder Joints with the Compliant Layer inWaferLevel Chip Scale Package under the Thermal CycleLiang Ying1，Huang Chunyue2，Xiong Guoji2，Zhang Xin1，Li Tianming3，Wu Song2，Guo Guangkuo2(1.DepartmentofElectronicEngineering，ChengduAeronauticVocationalandTechnicalCollege，Chengdu610021，China;SchoolofElectro-MechanicalEngineering，GuilinUniversityofElectronicTechnology，Guilin541004，China;DepartmentofAutomobileandPowerEngineering，GuilinUniversityofAerospaceTechnology，Guilin541004，China)16Abstract: The 3D finite element analysis models of the lead-free solder joint with theequivalentcompliantlayerinwaferlevelchipscalepackage(WLCSP)wereestablished.Basedonthemodels，theequivalentstressandstraindistributionunderthethermalcycleonthelead-free solderjointswiththecompliantlayerwereanalyzed，andthereliablefatiguelifeofthesolderjointwasalsocalculated.Thefirstcompliantlayerthickness，secondcompliantlayer thickness，die-side pad diameter and substrate-sidepad diameter were selected as the four key configuration parameters，an L ( 45 ) orthogonal arraywith16differentconfigurationparameterslevelscombinationsforthelead-freesolderjointwiththecompliantlayerwasdesigned.Theequivalentstressdataofthelead-freesolderjointsunderthethermalcyclewereobtained. The range analysis and variance analysis were equivalent made for the equi