厚膜混合电路无源网络制造PPT.ppt

第五章 厚膜混合电路无源网络制造 5.1 厚膜技术 指用丝网印刷技术或喷涂等方法，将浆料通过掩模在绝缘基板上制成所需的图形，再经过加热（烧结或固化）而制出厚膜元器件合集成电路的技术。 制造厚膜混合电路的典型工艺，包括如下主要步骤：基本制造工艺——浆料配制、印刷、烧结、阻值或容量微调、封装、测试。 ①基片的准备?②印制电感和导电圈（包括电容器的下电极）?③印制电容介质?④印制电容器上电极?⑤印制电阻?⑥参数微调?⑦元件包封?⑧组装?⑨测试?⑩封装。; 对于已选定的电路，在完成平面图案设计的情况下，厚膜元件的工艺流程通常包括：①制作原图?②制作掩模?③印刷、干燥、烧成?④参数微调。 工艺流程中元件制造的顺序, 原则上是热处理温度高者先印先烧。 由于电子计算机及有关技术的发展，厚膜生产线和生产设备本???都可以采用计算机控制，因此，这种生产线的系统化将成为今后的重要课题. ;图5.1.1 旧式厚膜电路生产系统示意图;图5.1.2 新式厚膜电路生产系统示意图; 新系统的基础是有效地利用CAD、CAM、CAT等一系列生产系统组成的CIMS系统（计算机集成制造技术），其特点是将高自动化生产和科学管理相结合，组成全线统一受控的一体化自动线，可大大提高生产率，减少不良品率和缩短生产线循环过程。 本章主要对厚膜电路中的导体、电阻、电容等无源网络的制造技术加以阐述，而外贴元件的组装及电路的封装在下一章介绍。;Prepared Artwork ;STEP 2: Printing Firing The printing and firing of the hybrid ceramics is like that done for the pottery business. A print occurs, then firing in an oven, then second print, then firing in the oven, etc. This cycle depends on the complexity of the hybrid circuit. Printing and firing multiple layers consists of conductors, resistors, insulators and surface protection glasses.;Engineering specialty hybrid furnace;STEP 3: Laser Trimming Setting the value and tolerance of resistors in the circuit by cutting a track in the fired resistor ink using a computer controlled laser beam. This can also be used for final circuit calibration and testing. A wide range of resistor values from milliohms to gigaohms along with ratings of up to tens of thousands of volts and fractional ratio tolerances can be achieved;STEP 4: Surface mounting Screen printing of solder paste, automated pick and place of surface mounted components on to the substrate and reflow soldering of the components.;STEP 5: Pin attach Adding lead frames (pins/legs) and soldering.;STEP 6: Manual Processing Includes soldering of large components, washing, inspection, encapsulation, labelling, testing, burn-in, quality assurance, packing and shipping.;Additional Step in Manufacturing Hybrids using semiconductor processes have the additional steps of semiconductor die attach, wire bonding and se