高速BGA封装与PCB差分互连结构的设计与优化.docVIP

高速BGA封装与PCB差分互连结构的设 计与优化 高振斌郝晓雪李雅菲王蒙军 河北工业大学电子信息工程学院 随着电子系统通信速率的不断提升，BGA封装与PCB互连区域的信号完整性问题 越来越突出。针对高速BGA封装与PCB差分互连结构进行设计与优化，着重分析 封装与PCB互连区域差分布线方式，信号布局方式，信号孔/地孔比，布线层与 过孔残桩这四个方面对高速差分信号传输性能和串扰的K体影响。利用全波电磁 场仿真软件CST建立3D仿真模型，最后时频域仿真验证了所述的优化方法能够 有效改善高速差分信号传输性能，减小信号间串扰，实现更好的信号隔离。 关键词： 串扰;封装;差分过孔;信号完整性;CST; 高振斌(1973一)，男，教授。研究方向为高速电路信号完整性。 2017-03-13 基金：河北省高等学校高层次人才科学研宂资助项FI (GCC2014011) Design and optimization for high-speed BGA packaging and PCB differential interconnection structure GAO Zhenbin HAO Xiaoxue LI Yafei WANG Mengjun Institute of Information Engineering， Hebei University of Technology: Abstract： With the constantly increase of the communication rate of the electronic systems, the signal integrity between BGA packaging and PCB interconnection area becomes particularly prominent. The high-speed BGA packaging and PCB differential interconnection structure were designed and optimized. The specific influences of the packaging and PCB interconnection area differential wiring mode, signal distribution mode, S/G ratio, wiring layer and via hole stub on the transmission performance of the high-speed differential signal and crosstalk performance are analyzed emphatically. The full wave electromagnetic field simulation software CST is used to establish the 3 D simulation model. The optimization method was verified with time-frequency domain simulation, which can improve the transmission performance of the high-speed differential signal, reduce the crosstalk among signals, and realize the perfect signal isolation. Keyword： crosstalk; packaging; differential via hole; signal integrity; CST; Received： 2017-03-13 近年来，球栅阵列（BGA）封装因体积小，引脚多，信号完整性和散热性能佳等 优点而成为高速1C广泛采用的封装类型U1。为了适应高速信号传输，芯片多采 用差分信号传输方式。随着芯片1/0引脚数量越来越多，BGA焊点间距越来越小, 由焊点、过孔以及印制线构成的差分互连结构所产生的寄生效应将导致衰减、串 扰等一系列信号完整性问题，这对高速互连设计提出了严峻挑战。目前国内外学 者对于板级信号完整性问题的研究仍多集中于水平传输线或者单个过孔的建模 与仿真，频率大多在20 GHz以內［2-6］。对于包括过孔、传输线的差分互连结构 的传输性能以及耦合问题研宄较少XII。并没有多少技术去减少封装与PCB互连 区域垂直过孔间的串扰。 木文针对高速BGA封装与PCB差分互连结构进行设计与优化。着重分析改进差分 布线方式，信号布局方式，信号孔/地孔比，布