besbelle和cms—我们参与的大型粒子物理前沿-cernindico.pptVIP

????????????????????????? Wei Hai, China; 30-November-2003 ?????? ????????????????????????? Wei Hai, China; 30-November-2003 ?????? ????????????????????????? Wei Hai, China; 30-November-2003 ?????? ????????????????????????? Wei Hai, China; 30-November-2003 ?????? ????????????????????????? Wei Hai, China; 30-November-2003 ?????? ????????????????????????? Wei Hai, China; 30-November-2003 ?????? ????????????????????????? Wei Hai, China; 30-November-2003 ?????? ????????????????????????? Wei Hai, China; 30-November-2003 ?????? Some GEB production and design related issues Yong BAN, Peking University Problems in last batch of GEB production (01/18): Bending of GEB board : Assure the flatness fulfill criteria with pressing procedure (Sinofast) Use rigid frame packaging in shipment (foam packing + paper box last time) Improve design: make copper area evening distributed in each layer if possible Short, open circuit etc.: Test and repair Improve design: e.g.: Standoff position shift: Reason: standoff put in position manually, pre-loaded tin in the hole may not distributed evening around while melting in high temperature, cause the position shift or tilted Use jig plate with precisely located holes during standoff soldeing. positioning and soldering with more caution, find best procedure with try and test (Sinofast) expect better quality in next GEB production * Present GEB activities in PKU: Coordinating GE1/1 GEB production in Sinofast: GE1/1 GEB test before shipment: Conductivity test: test facility developed with FPGA+LED ready and successfully used in previous production test → automatic logging with computer Bit Error Ratio: emulator e.g. got from Gilles, is starting to set up the facility Eye plot: check Eye Plot with some randomly selected channel manually Preparation for GE2/1 ME0 GEB RD material reading on GEB, VFAT, APV25…, to understand details software: Candece insta