室温ecap变形工业纯钛变形行为及组织性能研究-材料加工工程专业论文.docx

室温ecap变形工业纯钛变形行为及组织性能研究-材料加工工程专业论文.docx

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室温ecap变形工业纯钛变形行为及组织性能研究-材料加工工程专业论文

西安建筑科技大学博士学位论文 西安建筑科技大学博士学位论文 优秀毕业论文 万方数据 万方数据 精品参考文献资料 Study on Deformation Behavior and Microstructures and Mechanical properties of Commercially Pure Ti Processed by ECAP at Room Temperature Specialty: Materials Processing Engineering Name: Liu Xiaoyan Instructor: Prof. Zhao Xicheng Abstract Equal channel angular pressing (ECAP) can produce bulk ultra-fine grained (UFG) materials with high strength by severe simple shear. In order to develop its potential and extend its application field, commercially pure titanium with an average grain size less than 200 nm was fabricated by ECAP for up to 4 passes at room temperature using a die with the internal angle Φ of 90° and outer curvature angle Ψ of 20°. Advanced characterization and measurement techniques such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), X-ray diffraction (XRD), nano indentation and isothermal simulation and so on, are used to analyze microstructural evolution, to reveal mechanisms of grain refinement and plasitic deformation of CP Ti during ECAP at room temperature and deformation behaviors of UFG CP Ti. The microstructural evolution of CP Ti during ECAP was investigated by optical microscope, TEM and EBSD. The results show that dislocation slip is the main deformation mechanism of CP Ti during the ECAP process. Deformation twins are activated and accommodate the plastic strain by local stress concentration. Lots of shear bands and dislocation tangles are generated during the initial stage of ECAP, which develop to dislocation cells by dynamic recovery such as the rearrangement and annihilation of dislocations. With further deformation, all the grains will be refined into ultrafine grains with high angle boundaries (HABs) by continuous dynamic recrystallization (CDRX). The tensile properties and microhardness of as-received and ECAPed CP Ti were investigated by electronic tensile machine and Vickers m

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