与标准si工艺兼容的集成传感芯片的研究-机械工程专业论文.docx

与标准si工艺兼容的集成传感芯片的研究-机械工程专业论文.docx

与标准si工艺兼容的集成传感芯片的研究-机械工程专业论文

与标准Si工艺兼容的集成传感芯片的研究关键词:集成传感;集成光电三极管;集成压力传感器万方数据AbstractAbstractWiththerapiddevelopmentofmodemscienceandtechnology,people’Slivingstandardhasbeengreatlyimproved.Sensortechnologyhasbeenpaidmoreandmoreattentions,whichhasagreateffectonourlife.Wimitsadvantagesofhightechnologycontent,goodeconomicbenefitandwidemarketprospect,thesensorhasbeenrecognizedasapromisinghigh-techindustryathomeandabroad.Andtheintegratedsensorisflminiature,integratedandintelligent sensor,whichismadebyintegratedcircuittechnology.Withitsadvantagesofsmallsize,lightweight,highreliability,flexible interfaceandmicropowerconsumption,theintegratedsensoristhedevelopmentdirectionofthesensor.Inrecentyears,allkindsofnewintegratedsensorsareemerging,whicharewidelyused.EuropeandtheUnitedStatesandothercountriesshowaclearlead,andsomeofthedomesticresearchinstitutionshavealSOstartedtodosomeresearch.Butthereisstillabiggapintheproductsensitivity,reliabilityandcost.ThispaperproposestomaketheintegratedphotoelectrictransistorandtheintegratedpressuresensormadeinstandardSiprocess.Herealotofresearchhavebeendoneinthedesign,processing,packagingandtestingofthechipsInthispaper,themainworkareasfollows(1)Theworkingprincipleandperformanceadvantagesofthephotoelectrictransistorare analyzed,anditisintroducedhowtomakeit inthestandardSiprocess(2)Thestructureanalysisandsimulationofthephotoelectrictransistorarecarriedout.Fromtheeconomicpointofview,thephotoelectrictransistorwiththe areaof40x409m2,50×100I.tm2,80×1001am2,lOOxlOOjma2aredevelopedin0.25pmBCDprocessbyCSMC.ThetestresultsshowthatthemaximumresponseCanreach2.02A/W,thecurrentamplificationfactorbetaCanbeabout60andthe矗equencycharacteristicisgood(3)UsingtheMOSFETchannelregionastheequivalentpressuresensitiveresistanceoftheintegratedpressuresensor,thesimulationanalysisiscarriedoutbyCOMSOL.Theresultsshowthatthedesignedpressuresensorhasagoodsensitivity.A万方数据ResearchofIntegratedSensingChipsCompatiblewithStandardSiProcesscombinedregimenofCMOStechnologyandMEMStechnologyasthemanufacturingmethodis

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