cu基大块非晶合金的超塑扩散连接性能分析word格式论文.docxVIP

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cu基大块非晶合金的超塑扩散连接性能分析word格式论文.docx

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cu基大块非晶合金的超塑扩散连接性能分析word格式论文

Cu-basedbulkmetallicglasses(BMG)havemanyexcellentproperties,suchas highstrength,highhardness,goodcorrosionandwearresistance,whichareattractive foralotofapplications.However,itisunavoidabletoencounterthewelding problemsintheirapplicationsduetotheirsmallsize.Superplasticforming/diffusion bonding(SPF/DB)techniqueisanadvancedmanufacturingtechnique,whichhas manyadvantagescomparedtocoventionalmethods.Itcanrealizehighquality bondingofpartswithalargearea,andcanavoidtheweldingcracksandresidual themal stress caused bysolidification ofmelt materials. Thus, in the presentthesis, the SPF/DBmethodwasattemptedforthejoiningofCu-basedBMG.Onthebasisofits superplasticbehaviorinthesupercooledliquidregion.Theeffectsofthebonding parameters,suchasthebondingtempratureandbonddurationonthemicrostructure mechanismpropertieswereinvestigated.Onthisbasis,atheoreticalmodeofthe SPF/DBforthe Cu-based BMG was suggested.Themain results are as follow:Thedeformationof(Cu50Zr50)92Al8BMGsisstronglydependentonstrain ratesand temperatures. At thetemperature of470℃and 480℃,whenthestrain rateis 2.5×10-3s-1,themetallicglassbahavedexcellentsuperplasticity,theflowstrengthof(Cu50Zr50)92Al8 metallicglassis200MPaand68MPa,theconstitutiveequationofsuperplastic deformationis:????9?1011??sinh?0.03????????Exp???178000?.??RT??At the temprature of 480℃, the (Cu50Zr50)92Al8 metallic glass aresuccessfullydiffusionbondedin2-3hourswhentheappliedstressis200MPa.The analysisofinterfacefractureshowedthattheineterfacebondingisinafully metallurgical bond.Theshear strength of thebondinginterfaceis 25.25MPa.Thesamplesaftersuperplasticanddiffusionbondingpartialcrystallizedand thecrystallinephaseisCu10Zr7.Thehardnessofthesesamplesishigherthanthose alloys with fullyamorphous structure because ofcrystallization.Utilizing the improved Pilling diffusion bonding model, the process of superplasticanddiffusionbondingoftheCu-basedmetallicglassissimulated.Based on the complete understanding of the superplastic deformation mechanism and