基于数值模拟的厚板小孔类模具寿命预测与失效分析分析-life prediction and failure analysis of thick plate small hole dies based on numerical simulation.docxVIP

ABSTRACTABSTRACTAlong with the development of science and technology, product development changes with each passing day. There has been an increasing number of small hole products. Promotion of small holes on thick plate punching die are severely restricted because of its bad working environment. Among them, the die life is the main bottleneck of restricting itsdevelopment. The stress change of small holes on thick plate(4＜t＜6，d/t≤1) punching die isvery complex. Lack of in-depth research on small holes on thick plate punching die at present.This article select small holes on thick plate