石墨与铜的钎焊机理及新型低温活性钎料的制备-材料加工工程专业论文.docx

石墨与铜的钎焊机理及新型低温活性钎料的制备-材料加工工程专业论文.docx

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石墨与铜的钎焊机理及新型低温活性钎料的制备-材料加工工程专业论文

道,加速了其它元素的扩散、反应,使得钎料熔化,达到了降熔的作用;同 时,为钎焊过程提供了活泼的Ti原子。采用AgCuTi和AgCuTiSn钎料对实际 件进行焊接,并试车运行。结果表明,换向器工作状态稳定,该产品的使用 寿命达到 15000h以上,可以达到传统换向器使用寿命的 5 倍。本文建立了石墨/TiZrNiCu/Cu接头界面反应层成长动力学方程,并分析 了石墨/AgCuTiSn/Cu钎焊界面的反应机理。通过研究钎料与碳基材料的反 应机理可知,Ti基钎料实现连接主要是利用Ti与C反应生成TiC;Cr基钎料实 现连接主要是在界面反应层处产生一定厚度的CrmCn相反应层,其种类受到 钎焊温度、保温时间和钎料中含有的其它元素来决定。关键词 石墨;钎焊;Cu;机械合金化AbstractWith excellent thermal shock and heat fatigue resistance as well as high melting point and heat conductivity, graphite has wide application field. For example, graphite commutators can be used in not only all direct current engine, but also aviation, space and army fields. In this paper, commercial and self- developed brazing alloy were used to join graphite and copper. Interface reaction mechanism of the brazed joints and preparation principle of braze alloy were analyzed. The investigation not only fills up the technique blank of producing graphite commutators in our country, but also supplies technique reservation for joining carbon-based materials with dissimilar alloys.Ag, Cu, Ti, Sn powder were selected to make braze alloy by mechanical alloying, in which Ag powder was added by two ways (pure Ag powder or AgCu eutectic powder). The effects of ball milling time, ratio of grinding media and adding way of element on pattern of powder, grain size, degree of alloying and melting point of braze alloy were studied. The model of mechanical alloying was built and a local model of pitting flaking was also introduced. It can be known from mathematical, kinetic and thermodynamic models that when the milling speed increases, Pmax is large and the alloy powder is crushed heavily. If the powder grain is small, the stability of powder is good and the powder is not be melted during ball milling. When the rotary speed is 260r/min and the ball milling time is 7h, the average diameter of powder is below 20μm after ball milling.When TiZrNiCu filler was used to braze graphite with copper, the interface structure is graphite/TiC/Ti-Cu, Cu-Zr,

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