铜基钎料钎焊w-cu复合材料与不锈钢的连接机理研究-study on the joining mechanism between w - cu composite material brazed with copper-based brazing filler metal and stainless steel.docxVIP

Abstract fracturesurface is mainly composed of dimples and cleavage planes.The performance is slightly worse thanthe front solder,the bending strength is 440Mpa. Keywords tungsten-copper composite ； copper based brazing filler metals ； bending strength；microstructure ；fracture feature III 江苏科技大学工学硕士论文 江苏科技大学工学硕士论文 目 录 摘 要 ................................................................................................................................................................I Abstract ............................................................................................................................................................ II HYPERLINK \l _bookmark0 第 1 章 绪论 ................................................................................................................................................... 1 HYPERLINK \l _bookmark1 1.1 课题背景 ....................................................................................................................... 1 HYPERLINK \l _bookmark2 1.2 W-Cu 复合材料的特征 1 HYPERLINK \l _bookmark3 1.2.1 钨铜的生产工艺 .................................................................................................... 2 HYPERLINK \l _bookmark4 1.2.2 钨铜材料的应用前景 ............................................................................................. 3 HYPERLINK \l _bookmark5 1.3 铜基钎料的研究及钨铜复合材料的连接技术........................................................... 4 HYPERLINK \l _bookmark6 1.3.1 国内外研究现状 .................................................................................................... 4 HYPERLINK \l _bookmark7 1.3.2 可能遇到的问题 .................................................................................................... 8 HYPERLINK \l _bookmark8 1.4 研究内容和方法........................................................................................................... 9 HYPERLINK \l _bookmark9 1.4.1 研究内容 ........................................................................................