磁头折片组件55微米锡球激光喷射焊接工艺的研究-机械工程专业论文.docx

万方数据 万方数据 Classified Index: TG456.7 U.D.C: 621 Dissertation for the Master’s Degree of Engineering RESEARCH ON LASER JETTING BONDING PROCESS BY 55 MICRON DIAMETER SOLDER BALL FOR HEAD GIMBAL ASSEMBLY Candidate： Liao Qingjiang Supervisor： Associate Prof. Liu Shoubin Asst. Supervisor: Principal Engineer Wang Yanbin Academic Degree Applied for： Master of Engineering Specialty: Mechanical Engineering Affiliation： SAE Magnetics(H.K.) Ltd. Date of Defence: June, 2014 Degree-Conferring-Institution： Harbin Institute of Technology 哈尔 哈尔滨工业大学工程硕士学位论文 摘 要 磁头折片组件是由磁头与飞机折片组件焊接而成，其是实现硬盘高可靠性、 低价格的关键环节。目前磁头与飞机折片的焊接主要采用激光喷射焊接工艺， 本课题主要研究采用 55 微米直径锡球的激光喷射焊接工艺。 研究内容包括微米级锡球喷射焊接的力学机理、特点及影响。其中锡球与 焊嘴间的表面张力以及范德华力是主导阻力。仿真与实验结果显示小球造成焊 点的热应力作用在增加，同样条件下锡球尺寸的减小更容易引起焊点的裂缝。 采用最小二乘法建立激光能量、氮气气压在不同锡球直径的条件下的喷射焊接 工艺参数数学模型。分析激光能量、氮气气压以及激光光束分布对喷射焊接的 影响，根据实验结果，采用较高的氮气气压条件进行喷射焊接的焊点表面匀称， 喷射位置要更加集中。激光光束分布的不规则将影响到磁头折片组件的焊接合 格率。能量、气压太大或太小都会对喷射焊接质量造成影响，容易产生焊接缺 陷。通过参数优化实验找到较优的 55 微米喷射焊接工艺参数。针对 55 微米喷 射焊接之后的静态仰角离散问题，分析其影响机理。数据显示 55 微米喷射喷射 焊接工艺的热应力是造成微变形、影响静态仰角的主要因素，焊接夹具对产品 的静态仰角影响细微，可以忽略；优化喷射焊接顺序和增加舌片支撑可以使产 品的静态仰角得到改进。 关键词：磁头折片组件；喷射锡球焊接；55 微米锡球；焊接微变形 I Abstract Head Gimbal Assembly is made of slider and suspension per solder ball bonding, which is the critical step of HDD realizing high volume and low cost. Currently the bonding between slider and suspension is implemented by Laser jetting bonding process. This paper mainly researches on the laser jetting bonding process by 55 micron diameter solder ball. The mechanism and speciality and impact of jetting bonding by micron-size solder ball are studied. Herein the surface tension and Van Der Waal’s force are the major resisted force between solder ball and capillary, By FEA and experiment, it shows the smaller ball size, the bigger thermal stress of joints. Under the same condition, smaller diameter solder ball easily causes the micro crack to the joints. Impacts in jetting bonding process by nitrogen pressure, bonding energy and laser energy intensity distributi