大功率LED冲压以及冲击载荷响应分析-机械制造及其自动化专业论文.docx

Abstract In this paper, the response analysis for high-power LED module under stamping and impact load is conducted with simplified theoretical analysis, experimental testing and numerical simulation. The precise leadframe LED module is drawn with the help of 3D microscopy. The micro stamping processing is simulated by nonlinear FEA software ABAQUS, which focuses on deflection of lens in the process of micro stamping. The simulation results show that the lens of LED module has a small deflection caused by the gap in the asymmetric stamping process. The light intensity distribution and the illumination distribution of lead frame LED module are compared in normal situation and angle deflection situation of lens. The maximum light intensity is no longer in 90°vertical to the emitting surface. The light flux also decreases with the increase of the deflection angle. A self-made microelectronics drop impact tester consists of two parts: hardware and software. The hardware part includes base, frame, rails, bumper blocks, fixtures, electromagnet, test bench, sensors, amplifiers, A/O card and computer. The software interface of impact drop tester is based on Advantech 1712L data acquisition card . Data acquisition platform is based on virtual instrument graphical programming software LABVIEW, which can effectively accomplish high-speed data acquisition, real-time graphical display and store impact data to a text file. Reliability performances of high power LED module subjected to drop test conditions are evaluated experimentally. Good reproducibility dynamic parameters of impact force-time, acceleration-time are recorded for evaluating the impact response through the signal processing. In addition, a theoretical analysis of the impact dynamic progress is conduced, which shows the self-made drop tester is relatively precise by comparing the theoretical and experimental results. The major failure modes of LED module include lens fall off and crack formation in the impact expe