复杂互连结构信号完整性建模及故障测试研究-仪器仪表工程专业论文.docx

万方数据 万方数据 万方数据 万方数据 摘 要 摘 要 随着集成电路设计技术的飞速发展，电子工艺技术的不断提高，各种新技术被用 于电子系统的开发和设计中，与此同时，高速电路中由过孔、焊点、印制线构成的复 杂互连结构的信号完整性问题日趋严重。作为一整条传输路径，过孔和焊点具有的不 连续性和寄生效应，都会影响信号传输质量，在装配和生产过程中有可能出现的机械 工艺故障更是会严重影响信号传播。因此，对高速电路中由过孔、焊点、印制线构成 的复杂互连结构的信号完整性进行建模分析与故障测试方法的研究是十分有必要的。 本文针对高速电路中的复杂互连结构的信号完整性问题主要做了如下工作： 1. 根据信号完整性的相关理论，重点分析了信号完整性问题中的反射和串扰问 题。 2. 建立了由过孔、焊点、印制线构成的复杂互连结构模型，针对复杂互连结构 模型的回波损耗和近端串扰进行了仿真。分析对比了不同尺寸参数下的仿真结果，得 出了不连续性的强弱表现是回波损耗的主要影响因素，耦合间距和耦合长度是影响近 端串扰的决定性因素的结论。 3. 基于传输线理论、高速电路理论等信号完整性基础理论，提出了由过孔、焊 点、印制线构成的复杂互连结构的等效电路模型，并通过电路仿真验证了模型的正确 性。 4. 针对双路径复杂互连结构进行了故障测试，提出了故障电压检测法，针对过 孔裂纹故障和焊点空洞故障进行了实例验证，明确了故障电压检测法的优缺点，结果 表明该测试方法可以对微小故障进行有效的测试。 关键词：信号完整性，复杂互连结构模型，等效电路模型，故障测试 I Abstract Abstract With the rapid development of integrated circuit design technology and improvement of electronics technology, varieties of new technologies are used in development and design of electronic systems. At the same time, signal integrity problems in high-speed circuit interconnect structure are increasingly serious, especially for complex interconnect structure included via holes, solder balls and traces. As a whole transmission path, via holes and solder balls have discontinuities and parasitic effects which will affect the signal transmission quality. Mechanical process failures may arise in assembly and production processes will seriously affect signal propagation quality. Therefore, the research on the signal integrity issue modeling analysis and fault diagnosis method of complex interconnect structure constituted by via holes, solder balls and traces in high speed circuit is very necessary. For the problems of signal integrity in high speed circuit complex interconnect structure this paper mainly does the following work: According to the related theory of the signal integrity, the reflection and crosstalk problems are emphatically analyzed. The electromagnetic modeling for complex interconnect structure by via holes, solder balls and traces is established. The return loss and the next crosstalk of