高导热石墨铜复合材料的制备及性能研究-材料加工工程专业论文.docxVIP

华 中 科 技 大 学 硕 士 学 位 论 文 II Abstract With the increasing of chip integration, more and more heat resulting, we need to meet the higher requirements on the heat sink materials of electronic devices. Compared with traditional heat sink materials, like copper and aluminum, graphite/copper composites have higher thermal conductivity, lower density, and outstanding performance. It’s the one of most potential development direction of heat sink materials. Graphite has rich resources and easy to obtain, it’s provide the material foundation for the wide application of the composites. The research on graphite/copper composites has a great theoretical significance and practical value. In this experiment, electrolytic copper powder and natural flake graphite were used to prepare graphite/copper composites by re-pressing and re-sintering process. By observing the powder morphology, the appropriate technology of mixing powder is determined. First, use high-energy ball milling electrolytic copper powder to break up its structure, and then mixed it with graphite powder by low speed ball. Through the analysis of the microscopic structure of the composites, study on density, bending strength and thermal conductivity change with the content of graphite in the composites. The study showing: because of the pressing pressure is too small, most of copper in re-sintering composites still present in powder form, the combination of copper powder is not completely; with the increasing of graphite, it fragmented copper substrate more and more obvious; under the effect of copper powder sintering to decreases volume and graphite heat expansion, the density of the composites increases first and then decreases after re-sintering; due to the mechanical coupling between the powder particles, and low relative density, resulting in a low bending strength of the composites, decreased rapidly with the increasing of graphite. when the content of graphite is less than 60%, it can be able to meet the req