pcb板制作工艺流程介绍.ppt

* ? THIN CORE ? A thin laminate material (usually under .025” thick) consisting of a glass epoxy Substrate clad with copper on both sides. ? The size of the core is larger than the finished size of the Board. ? Dry Film Resist Coat ? A light sensitive film is applied by heat and pressure to the copper surfaces of the core. * * * * * * 12. 塞孔(Hole Plugging) 13. 去溢膠 (Belt Sanding) 14. 減銅 (Copper Reduction) → Option 15. 去溢膠 (Belt Sanding) → Option 16. 外層壓膜 Dry Film Lamination (Outer layer) Photo Resist 17. 外層曝光 Expose UV光源 18. After Exposed 19. 外層顯影 Develop 20. 蝕刻 Etch 20. 去乾膜 Strip Resist 21.壓合 (Build-up Layer Lamination) RCC (Resin Coated Copper foil) 21. 護形層製作 (壓膜)(Conformal Mask) Dry Film (乾膜) Dry Film (乾膜) Artwork (底片) Artwork (底片) 22. 護形層製作 (曝光)(Conformal Mask) Before Exposure After Exposure 23.護形層製作 (顯像)(Conformal Mask) 24. 護形層製作 (蝕銅) (Conformal Mask) 25.護形層製作(去膜) (Conformal Mask) 26. 雷射鑽孔 (Laser Ablation)及機械鑽孔 Mechanical Drill (P.T.H.) Laser Microvia (Blind Via) 27. 機械鑽孔 (Mechanical Drill) 28. 電鍍(Desmear Copper Deposition) 29. 外層線路製作 (Pattern imaging) 壓膜(D/F Lamination) 曝光(Exposure) 顯像(D/F Developing) 蝕銅 (Etching) 去膜(D/F Stripping) 30. 防焊(綠漆)製作 (Solder Mask) WWEI 94V-0 R105 31. S/M 顯像 (S/M Developing) 32. 印文字 (Legend Printing) 33. 浸金(噴錫……)製作(Electroless Ni/Au , HAL……) WWEI 94V-0 R105 WWEI 94V-0 R105 Dedicate or universal Tester Flying Probe Tester 34. 成型 (Profile) 35. 測試 (Electrical Testing) WWEI 94V-0 R105 WWEI 94V-0 R105 36. 終檢 (Final Inspection) 37. O.S.P. (entek plus Cu_106A….) →Option LASER BLIND BURIED VIA LAY-UP A = THROUGH VIA HOLE (導通孔) B = BURIED VIA HOLE (埋孔) C = One Level Laser Blind Via (雷射盲孔 ) LASER BLIND BURIED VIA LAY-UP BURIED VIA AND LASER BLIND VIA OPTION (雷射盲埋孔之選擇) D C C D = Two Level Laser Via (雷射盲孔 ) C D C B-STAGE FR-4 Core RCC FR-4 Core B-STAGE RCC A B B A BURIED VIA LAY-UP A = THROUGH VIA HOLE (導通孔) B = BURIED VIA HOLE (埋孔) C = BLIND VIA HOLE (盲孔 ) D = BL