光电子器件封装的压力传感检测技术研究电路与系统专业论文.docxVIP

Abstra Abstra ct In the optoelectronic device package，small offset to the coupling interface is one of the key factors affecting the optoelectronic properties． Because it is difficult to control control gaps，contact force cannot perception problem between the waveguide array chip and fiber in the package，resulting in optoelectronic coupledunstable injury collisio ns even spacing，low yield and poor consistencyof performance．This paper focus on the structure and design of sensor and the small signal detection．The aims of the researeh is the application of sensor technology to complete the contact force between the waveguide array chip and fiberd the size of the displacement detection analysis．Eventually，the encapsulation efficiency can be improved through the measured signal to the automatic installation of a reasonable adjustment． Firstly，the relationship between the force，displacement and strain of the cantilever beam is studied and analyzed．Designed a new type of sensor based on cantilever beam structure modeland derived the relationship power，displacement and strain．Then，optimization of structure parameters by ANSYS finite element analysis．The sensor can well realize the purpose of force and displacement of the simultaneous detection of,its advantages are mainly embodied in：on the one hand，the small displacement amplification and detection，reduce the error brought by the direct detection，improve accuracy；maximum displacement and strain coincidence is achieved on the other hand，making under the action of the same force enable effective detection when the mean strain value maximization，to improve the detection sensitivity． Secondly，according to the small signal detection of the sensor structure proposed in this paper design a amplification circuit．The circuit 万方数据 adopts adopts the ICL7660 chip conveIrt single power supply to the double power supply，and amplifying circuit with high accuracy amplifier AD620 instrument of simplified design．Then the theoretic