印刷电路板的乙二胺络合浸镀银工艺-福州大学学报.PDFVIP

35 4 ( ) V o l 35 No 4 2007 8 Journa l of F uzhou U n iversity( N a tura l Sc ience) A ug 2007 : 1000 - 224 3( 2007) 04 - 06 16- 04 1 2 , ( 1 , 350002; 2 , 350002) : , , pH , 3 g / L, 15, pH 11 3 , : ; ; ; : TG 146 1 : A Finishing of printed circuit board in ethylenediam ine- containing imm ersion silver system 1 2 WE I Zhe- liang , TANG D ian ( 1 Co lleg e of M echanical Eng ineering and A utom ation, Fuzhou U n ive rs ity, F uzhou, Fu jian 350002, Ch ina; 2 College o f M ater ia ls Science and Eng ineer ing, Fuzhou U n iversity, Fuzhou, Fu jian 350002, China) Abstract: Imm ersion silver ( I- A g) on printed c ircu it board ( PCB ) w as prep ared by add ing ethy l enediam ine ( en) as the ligand The effects of silver ion concentration, ligand am ount and pH value on A g deposition rate and fin ish ing app earance in en - conta in ing I- A g system w ere studied by electro chem ical m ethod and FE - SEM The resu lts show th at an optmi a l condition o f the process can prepare a smooth and dense silver coating on PCB The optmi ized factors are as fo llow s: the silver ion concen trat ion is 3 g /L, m o lar ratio of silver ion and en is 15, the pH valu e is 11 3 Keywords: mi m ersion silver; galvanic current; printed c ircu it board; ethy lenediam ine ( PCB) ,