倒装芯片封装技术概论-集成技术-中国科学院深圳先进技术研究院.PDF

Vol. 3 No. 6 JOURNAL OF INTEGRATION TECHNOLOGY Nov. 2014 1 1 1 1 2 1 ( 518055) 2 ( 999077) I/O I/O TN 305.94 A An Introduction to Flip-Chip Packaging Technology ZHANG Wenjie1 ZHU Pengli1 ZHAO Tao1 SUN Rong1 WONG Chingping2 1( Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China ) 2( The Chinese University of Hong Kong, Hong Kong 999077, China ) Abstract As the high density package is moving towards miniaturization, high I/O density, better thermal and high technology is highly expected due to its high area array I/O interconnection, short signal path, high thermal dissipation, high electrical and thermal performance. In order to enhance the reliability of a flip-chip on organic board package, Keywords 2014-07-16 (2011D052) (KYPT20121228160843692) ( 2012 372 ) ; () E-mail pl.zhu@siat.ac.cn () E-mail rong.sun@siat.ac.cn / 85 1 IBM 360 3