基于机器视觉的QFP芯片三维外观检测-机械电子工程专业论文.docxVIP

华中科技 大学硕士 学 华 中 科 技 大 学 硕 士 学 位 论 文 II II Abstract IC (Integrated Circuit) chips have been widely used in national defence, aerospace, energy resource and medical treatment fields, and their production technology is considered as one of the high-tech which affects the development of 21st century. The three-dimensional appearance inspection is an critical step in the manufacturing process of chips. Specially, it’s very significant to detect the three-dimensional appearance of QFP (Plastic Quad Flat Package) chips, because they are one of important IC chips. This thesis investigates the three-dimensional appearance inspection based on machine vision according to the features of the QFP chips, such as small dimensions, multi-pin, and large output. The major research work is as follows: The thesis finishes the demand analysis for the three-dimensional appearance inspection system of QFP chips, and determines the major Technical indicators including the ability to detect the chip’s size range, test items, test accuracy and speed, and discusses the current machine vision inspection system applications. Finally, it designs the system which includes visual image acquisition, testing software development based on the mil package, multi-threaded design, database management, serial communications, etc. The thesis designs the hardware for image acquisition and detecting software systems which meets the requirements of the inspection of QFP chips, and carries out optical design, chooses visual hardware according to optical requirements, and designs the mechanical structure. Among them, the optical path uses a single camera with four planar speculas on the way for the three-dimensional detection problem, which not only reduces the difficulties of calibration and the software for calculating the chip three-dimensional targets, but also reduces the cost, and uses parallel optical path design to solve the imaging difficulties dued to chips’ large range in dim