SMT常见焊接不良.ppt

SMT常見焊接不良 1:錫珠(Solder ball) 2:錫渣(Solder splashes) 3:側立(Mounting On Side) 4:少錫(Insufficient solder) 5:立碑(Tombstone) 6:虛焊(Unsoldered) 7:偏位(Off Pad) 8:焊盤翹起(Lifted land) 9:少件(Missing Part) 10:冷焊(Cold solder) 11:反白(Upside down) 12:半濕潤(Dewetting) 錫珠(Solder Ball) 錫渣(Solder Splashes) 側立(Gross placement) 少錫(Insufficient Solder) 立碑(Tombstone) 虛焊(UnsolderedNonwetting) 偏位(Off Pad) Pad翹起(Lifted Pad) 少件(Missing Part) 冷焊(Cold SolderIncomplete reflow of solder paste) 反白(Gross placement) 半濕潤(Dewetting) 反向(Polarity Orientation) 殘留助焊劑 (Flux Residues) 錯件(Wrong Part) 多錫(Extra Solder) 多件(Extra Part) 燈芯(Solder Wicking) 錫裂(Fractured solder) 短路(bridging) 針孔(Pinholes) 元件破損(Component Damaged) 標籤褶皺 (Lable peeling) 共面度(Coplanarity Defect) PCB常見缺失 1:焊盤氧化(Pad discoloration) 2:漏銅(Exposed Copper) 3:VIA孔不良(Via defect) 4:線路短路(Trace short) 5:分層(Dlamination) 6:板翹(Twist board) 7:Pad沾綠油(Soldermask on Pad) 8:絲印不良(Defect Silkscreen) Pad氧化(Pad Discoloration) 漏銅(Expose Copper) VIA孔不良(Via Defect) 線路短路(Trace short) 分層,氣泡(Dlamination) 板翹Twist board) Pad沾綠油(Soldermask on Pad) 絲印不良(Defect silkscreen) PCB髒污(Contamination On PCB) PCB斷線(Trace open) 白斑(Measling) PCB常見不良 發生起泡,分層區域不超過鍍覆孔,或內部導線間距25% PCB常見不良 PCB四個角不在同一平面上 PCB常見不良 Pad 上沾有綠油,影響正產焊接 PCB常見不良 絲印重影,造成不可辨識 PCB常見不良 表面殘留灰塵,金屬顆粒物質 * * 13:反向(Polarity Orientation) 14:殘留助焊劑(Flux Residues) 15:錯件(Worng Part) 16:多錫(Extra solder) 17:多件(Extra Part) 18:燈芯(Solder wicking) 19:錫裂(Fractured Solder) 20:短路(Solder short) 21:針孔(Pinhole) 22:元件破損(Component Damaged) 23:標籤褶皺(Lable peeling) 25:共面度不良(Coplanarity Defect) SMT常見焊接不良 焊接过程中的加热急速而使焊料飞散所致 ,焊料的印刷错位，塌边 SMT常見焊接不良 由於焊料潑濺於PCB造成,網狀細小焊料 SMT常見焊