基于图像的电路板元件贴装缺陷检测系统-计算机系统结构专业论文.docxVIP

华 华 中 科 技 大 学 硕 士 学 位 论 文 II II Abstract Printed Circuit Board(PCB) is a carrier integrating various electronic component. With the continuous development of technology and progress of industry, the Manufacturing technology of PCB is becoming more and more complex which makes the quality examination of PCBs a difficult task. Traditional inspection arithmetics are simple and inefficient which cant inspect more kind of electronic component. In order to improve the status, developing a more efficient and accurate PCB inspecting system has become an emergent and significant task. The former researcher has confirmed the project that identifies the various PCB defects automatically with optic photographic system and image analysis technique. Begin on analyzing the geometric character of electronic component, we research the electrolytic capacitors, QFP(Quad Flat Package) and BGA(Ball Grid Array Package)s inspection arithmetics. As for electrolytic capacitors’ inspection, the similar circular of the reflecting surface can be got by using mathematical morphology and Hough transform. As for QFPs inspection, the rectangle which is similar with QFPs body can be got by presenting an improved region Growing algorithm, and the QFPs geometric data can be got by using Hough transform which can detect the edge. As for BGAs inspection, the positions and defects of solder joints can be inspected by using an arithmetic which is based on seed filling to get it’s geometric data. Experimental results reveal that the speed and accuracy of inspection arithmetics are robust and can meet the actual manufacture’s request. The system can inspect most of the components faults effectively. Keywords: circuit board component, image, inspection, Quad Flat, Ball Grid Array PAGE IV PAGE IV 目 录 摘 要 ············································································································ I Abstract ················································································