聚合物模塑成型冷却过程中温度场和应力场的数值模拟.pdf

四川大学顾士论文 NumericalSimulationofthe Field Temperature andtheResidualThermalStress the Fieldin ProcessoftheMolded Parts Cooling Polymer Material ProcessingEngineering Bo sot：AssociateProf．thenLimin Postgraduate：WangSupervi Withthe ofthe ofthe theories development rheology，heattransfer， thermal andthemodern stress，computer graphics circumstancesand conditionsinthe physical complexboundary molding asthe ofthe ies process，suchtemperaturedependentphysicalpropert ofthe solvedNumericalsolution．Heat polymers，wereby transfer， thermalstressandthestressdistributioninthe couldbe parts sjmulated． This constructedthe modelandthe paper physics mathematicalmodel ofthe fieldand temperaturetheresidualthermalstressesfieldinthe cool ofthemolded on ingprocess thehematerial polymerparts，based ofheat science，theorytransfer，rheology，computer thefinitedifferencemethodto simulatethe numerically temperature fieldand theresidualthermalstressesfieldinthe molded