固体中缺陷的超声散射计算与测量技术研究-机械电子工程专业论文.docxVIP

华 华 中 科 技 大 学 硕 士 学 位 论 万方数据 万方数据 Abstract In order to study the interaction mechanism between ultrasonic waves and defects in solids, the paper conducted in-depth research by using finite element simulation and dynamic photoelastic method. On the one hand, simulating the propagation characteristics of ultrasound in solids by the finite element simulation method. Firstly, taking the ultrasonic propagation velocity in the medium as a reference amount, analyzing and verifying the feasibility of ANSYS to simulate the propagation characteristics of ultrasonic waves in solids; Secondly, using ANSYS to simulate the interaction mechanism of ultrasonic waves and typical defects, like holes and cracks, and analyzing the interaction mechanism between these two defects with ultrasonic waves. On the other hand, based on the principles of static photoelastic and stroboscopic imaging, designing and developing a dynamic photoelastic observation device to study the propagation characteristics of ultrasonic waves in solids. The dynamic photoelastic observation device consists of elastic module and strobe light control module. Elastic module shows the size of stress in the form of light strength, and demonstrating by light and dark stripes. Strobe control module is mainly used to compensate for the lacks of static photoelastic principle and to achieve synchronic delay control of sound and light. According to the principle of stroboscopic imaging timing requirements, using Verilog hardware description language to control FPGA (Field Programmable Gate Array) platform, and achieving the experimental device control, and then, through amplification circuit to drive LED strobe light, at last, achieve requirements of ultrasonic visualization design successfully. Key Words: Ultrasonic wave, Scattering, Photoelastic, Stroboscopic imaging，FPGA II 目录 摘要................................................................................................................... I HYPERLINK \l _bookmar