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Silicon Photonics: Challenge
and Opportunity in Big Data Era
周治平. 北京大学
Zhiping Zhou
Peking University, China
zjzhou@
CIOEC, Sept. 2, 2015
Shenzhen, China
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Silicon Photonics
Edited by Zhiping Zhou
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Outline
• Interconnect and the emerging silicon
photonics
• Current silicon photonics interconnect
• Difficulties and challenges
• Conclusions
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Applications push the growth of data centers
Source: Intel IDF14
Scalability: both quantity and continuous
improvement of device performance
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Today’s interconnects in data centers
Source: M Paniccia, Presentation at Purdue University (2007).
Rack to rack: optical (VCSEL-based)
In-rack: imminent transformation to optical solution
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Today’s racks in data centers
In-rack: copper interconnect
• High speed
difficult for 20 Gbps/wire • Low energy consumption
Trend: 25G/50G/100G or higher • Easy to use
Copper interconnect can no longer provide the
desired speed, must turn to optical interconnects.
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Advantages of optical solution
Speed
25 Gbps/channel commercialized, 50~70 Gbps/channel
possible in the future
Scalability: multiplexing
• Space division multiplexing: multiple cores or fibers
Up to 64 fibers (MXC) in an AOC, aggregated
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