激光烧结制备电子封装用钨铜复合材料-材料加工工程专业论文.docxVIP

Abs Abstract The laser sintering prepared electronic package with tungsten-copper composite material ABSTRACT The copper tungsten composite material is typical of the metal matrix composite, and also has the characteristic of the copper of the metal tungsten and the metal: good thermal capacity, low thermal expansion coefficient, and has a good mechanical strength and the like, and for tungsten, and copper are not mutually miscible metal group, we can use the existing model to design calculation prepared in a certain ratio to a tungsten-copper composite material thermal conductivity, thermal e