封装工艺的培训.ppt

QFP Process Flow Back Grounding Taping De-taping Mount Die Saw(Dicing) Die Bond Epoxy Cure Plasma Wire Bond Molding PMC Mark D/D Plating Trim/Form FVI IC Package Basic Introduction Back Grounding Taping De-taping Mount Die Saw(Dicing) Die Bond Epoxy Cure Plasma Wire Bond Molding PMC Mark Ball Attack Singulation FVI IC Package Basic Introduction BGA Process Flow ? TM2633 B92283.1 #6 9852Z Process Flow of QFP Place wafers in the tape frame to facilitate the die saw process. WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING Process Flow of QFP Cut wafers into single die unit according to the specific die size. WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING Process Flow of QFP Attach dice to the lead frame WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING Process Flow of QFP WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING To connect the die pad and the lead frame by gold wire, which makes the die function work when lead frame is connected with outside device. Process Flow of QFP WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING To encapsulate the wire-bonded I.C. to protect the die and gold wire from damage, contamination oxidation. Process Flow of QFP WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING xxx? TM2633 B92283.1 #6 9852Z TM2633 B92283.1 #6 9852Z To imprint legend on top side of the product by ink or laser for Identification of device type. The marking content include logo, lot no., date code device type and so on. Process Flow of QFP WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST M