课件：ADC设计.ppt

* * * ESR; 等效电阻； * LOW AND HIGH FREQUENCY DECOUPLING Each power supply should be decoupled to the low-impedance ground plane with a high quality electrolytic capacitor at the point it enters the PC board. This minimizes low frequency noise on the supply runs. At each individual analog stage, further local, high-frequency-only filtering is required at the individual IC package power pins. Figure shows this technique, in both correct (left) as well as incorrect example implementations (right). In the left example, a typical 0.1-μF chip ceramic capacitor goes directly to the opposite PCB side ground plane, by virtue of the via, and on to the ICs GND pin by a second via. In contrast, the less desirable setup at the right adds additional PCB trace inductance in the ground path of the decoupling cap, reducing effectiveness. All high frequency (i.e., ≥10 MHz) ICs should use a bypassing scheme similar to Figure for best performance. The ferrite beads arent 100% necessary, but they will add extra high frequency noise isolation and decoupling, which is often desirable. Possible caveats here would be to verify that the beads never saturate, when the ICs are handling high currents. Note that with some ferrites, even before full saturation occurs, some beads can be non-linear, so if a power stage is required to operate with a low distortion output, this should also be checked. * MULTICARD MIXED-SIGNALS SYSTEMS The best way of minimizing ground impedance in a multicard system is to use a motherboard PCB as a backplane for interconnections between cards, thus providing a continuous ground plane to the backplane. The PCB connector should have at least 30-40% of its pins devoted to ground, and these pins should be connected to the ground plane on the backplane motherboard. To complete the overall system grounding scheme there are two possibilities: 1. The backplane ground plane can be connected to chassis ground at numerous points, thereby diffusing the various ground cur