封裝工艺员入门教材.pdfVIP

序 言 1948 年晶体管发明，半导体集成电路技术随之高速发展，从数字影像，移动通讯到汽 车电子，无处不闪现集成电路的光芒，人类的生活也因此而改变。21 世纪之集成电路已成 为信息产业及高新技术的核心和未来经济发展的基石。 所谓[封装技术]，是指为支撑、固定、保护这些高密集度的集成电路元件，同时借由 元件间连线，进而实现现代化电子设备系统的技术。随着芯片性能的提升及尺寸的缩小， 各种新的封装形式及形态应运而生，如锡球阵列封装 BGA（Ball Grid Array），多芯片层叠 封装 MCM（Multi Chip Modules）等。为实现这些全新的封装方式，封装技术变得愈加细化， 从材料物性、激光焊接、设计及生产自动化技术以至整个系统的软硬件配置无一不需要专 业的人士来灵活运用。 本书根据半导体封装业界要求及学生学习兴趣，在简要介绍封装相关基础知识后，重 点讲述了封装的制程技术、封装材料、封装可靠性及缺陷分析等内容。此外，对封装发展 的未来方向及新兴课题等也有所著墨。书中尽量使用简单基本的数学公式，以实际分析结 果提出技术性解决方案，加深读者的理解。 期待本书可以激发广大封装技术初学者的兴趣，并为将来踏入本行业打下坚实之基础。 最后，特别感谢复芯微电子邓善修总经理对出版本书的大力支持，大学教育组全体同 仁在校稿、排版、印刷方面给与的大量协助，以及让我引用参考文献的作者朋友，由于诸 位的支持及指导，本书才得以付梓，在此献上我最深的谢意。 编 者 I 目 录 第一章 封装简介 ·······················································································································1 1.1 简介································································································································· 1 1.1.1 封装的定义 ·················································································································1 1.1.2 封装的功能 ·················································································································2 1.1.3 封装的五个阶段 ·········································································································3 1.2 封装技术的发展历史 ····································································································· 4 1.2.1 封装技术发展趋势 ················································································