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Document Title :
Bond Stick Detection System in PESO29 and SG-39
Page PAGE 4 / 9
Revision :
A
Document no :
ESS-DG-2003-003B
Date : Nov. 2003
By : A.Baskaran,
ASM PROPRIETARY INFORMATION - NOT TO BE REPRODUCED OR COPIED WITHOUT WRITTEN PERMISSION
ASM Technology Singapore
ASM Technology Singapore
Electronic System Group, R D Department
Security Class
Document Type
Document Number
Part No
Rev
Year
A
DG
ESS-DG-2003-003B
B
2003
Restricted
Design Guide.
Title:
Title:
Design Guidelines for
Bond Stick Detection System in PESO29 and SG-39
Revision :
B
Author(s) :
A. Baskaran
Date :
Dec 2003
Copyright Notice:
Copyright Notice:
This document contains information proprietary to ASM Technology Singapore Pte. Ltd., and should not be used for engineering design, procurement of manufacturing in whole or in part without prior written consent of ASM Technology Singapore Pte. Ltd..
No part of this publication may be reproduced, photocopied, stored on a retrieval system, or transmitted without prior written consent of ASM Technology Singapore Pte. Ltd..
? 2000 ASM Technology Singapore Pte. Ltd.. All Rights Reserved.
TOC \o 1-3
0. REVISION 1
1. OBJECTIVE 1
2. Bond Stick Detection principal 1
3. First Bond Stick Detection. 2
3.1 Output resistance switch setting 3
3.2 Measuring Wire clamp and stray capacitance 3
3.3 Setting Applied voltage and Threshold Voltage 3
4. Second Bond Detection 6
4.1 Setting stick adjust time 7
5.Tail Break. 7
6.Tail Short. 7
7. Measure the Bond stick signal current through the Die. 8
0. REVISION
Rev: A 20--Nov– 2003
Revision History:
A 20-Nov-2003: Design Guidelines for Bond Stick detection system in EFO models PESO29 and SG-39.
B 08-Dec-2003: Setting Applied Voltage and Threshold voltage improved, Tail Break and Tail Short are added.
End
1. OBJECTIVE
The objective of this document is to understand the Bond Stick detection principal implemented in PESO-29 and SG-39 EFO.
2. Bond Stick
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