电力电子集成模块用平板型热管基板的传热特性.docVIP

第47卷 第1期 2002年1月 简 报 PAGE 2 PAGE 7 电力电子集成模块用平板型热管基板的传热特性 张良华1，余小玲2，杨旭1，周恩民2，冯全科2，王兆安1 （1.西安交通大学电气工程学院,710049,西安 2.西安交通大学能源与动力工程学院，710049，西安） THERMAL CHARACTERISTIC OF HYBRID INTEGRATED POWER ELECTRONIC MODULE (IPEM) BASED ON A NOVEL FLAT PLATE HEAT PIPE Zhang Liang-hua, Yu Xiaoling , Yang Xu, Zhou En-ming, Feng Quan-ke, Wang Zhao-an （Xi’an Jiaotong University, Xi’an 710049, Shannxi Province,China） 第47卷 第1期 2002年1月 简 报 PAGE 2 PAGE 2 ABSTRACT: The research objective is to solve the issue of thermal focus and thermal influence in the IPEM, enhance the heat spread and implement the thermal management integration. This paper presents the thermal characteristic of hybrid integrated power electronic module based on a novel flat plate heat pipe filled with negative-ion water, including the heat pipe operation, IPEM’s thermal structure and lumped-parameter thermal model. The thermal model is validated by experimental result on both the static and transient thermal performance. In the paper, the IPEM thermal performance compared with two IPEMs based on copper substrate and heat pipe filled with air has been described in detail. The experimental result indicates that in different orientations heat pipe operating at high thermal conductivity and high convection coeficience on evaporator improves the IPEM heat spread capacity, decreases 30 percent of the thermal resistor value between die, DBC and solder. And the maximum thermal flux density of IGBT dies reach to 186W/cm2. With the heat flux increase, the IPEM thermal resistor decreases, which enhances resistance of thermal strike. KEY WORDS: IPEM；Flat Plate Heat Pipe；Thermal Characteristic；Thermal Model 摘要：为了解决集成模块中面临的热集中和热影响问题，提高模块的热扩散能力，并实现模块热管理集成，本文对基于新型垂直传热平板热管的电力电子集成模块的传热特性进行了研究。文中介绍了小型径向平板热管的工作机理，建立了基于该热管的集成模块热路模型，该集成模块的稳态和瞬态传热实验结果验证了该模型的有效性。并且，将该热管基板模块与纯铜基板和空气填充热管基板模块在稳态和瞬态传热特性进行了对比。实验结果表明，热管基板的等温性和蒸发端的高对流换热系数增强了模块的热扩散能力，削弱了模块的热集中现象，管芯、DBC和焊料层的热阻相对于铜 基板集成模块减小30％，并且在正反放置的情况下热管具有相同的高效散热能力，IGBT管芯的最大热