笔记本结构设计经验教训NBMEDesignLessonlearn.pptVIP

Case 10 Root Cause: 雞眼釘干涉 Copper rivet 雞眼釘 pit is 0.35 mm Mylar thickness is 0.1 mm Total thickness is 0.45 mm 2D Dimension of AMD the Gap between CPU die and capacitor is only about 0.2 mm Case 10 Solution 1:抽拉銅柱固定方式 製程方式： Cu heat spreader 先抽拉出銅柱，之後再放入一個鉚合模鉚合彈片，銅塊。此方式可確保 heat spreader 面限高為零！ 限高 0 mm Solution: Case 10 Solution: 製程： Cu heat spreader 先經一套鉚合模，鉚入實心銅柱，接下來在進另外一套鉚合模，鉚合彈片及銅塊。此方式需用到兩套鉚合模，故成本較高。但此方式亦可確保 heat spreader 面限高為零！ 限高 0 mm Solution 2:鉚接實心銅柱固定方式 Case 11 Issue: RAM door rib short to RAM capacitance as press the door Root Cause: Case 11 Solution: 1. Add mylar on ram door rib to prevent this risk. 2. Have ec to cancel this rib to enlarge gap. Case 12 Issue:1. No post or No power 2. MB can power on when press N.Bridge by finger Case 12 FA: Case 12 FA: Dye-Pry Case 12 FA: Dye-Pry Case 12 FA:Cross Section Case 12 FA:Cross Section Case 12 FA:Cross Section Based on above analysis (crack location and multiplex crack interface ), suspect the Crack may caused by external stress. NB ME Lesson Learn Case 1 Issue: Hinge boss crack Case 1 Root cause/Solution: Case 1 Root cause/Solution: Case 2 Issue: Hinge Bracket broken Case 2 Root cause/Solution: Case 2 Root cause/Solution: Case 3 Issue: E-sata Jack Interferance Case 3 Root cause/Solution: For strength concerned to EC hinge support Case 3 There are different type Jack?RD check Molex only (no plastic),foxconn and tyco have plastic 0.7mm high? interfere 0.3mm Root cause/Solution: Case 3 Root cause/Solution: Case 4 Issue: Smile gap Root cause/Solution: 1.Refer to the picture, the dimension of the center of the axis to the iron surface is 15.55mm±0.1mm. 2.Old hinge actual date for 5 units as below: (1)15.48mm (2)15.43mm (3)15.43mm (4)15.40mm (5)15.45mm → ST: Reduce rubber height LT: Add height of Axis Case 5 镭雕区域 非镭雕区域 Issue: Power button UV coating peel off Case 5 Root cause: Process Coating thickness Substrate Black base coating Primer (Base coating) Plating UV coating 15 μm 8 μm 1.