镭射钻孔培训教程.pptVIP

Prepared by: Bin Liu Date:9/25/2005;前言 LASER钻孔简介 LASER钻机介绍 Microvia制作工艺 Microvia 常见缺陷分析; 随着PCB向微型和高密度互连的方向发展，越来越多制板采用微导孔的连接方式实现高密度互连，而目前制作微导孔的主要方法是laser drill。如何利用现有镭射钻机制作出各种高质量的microvia，是现在PCB制造的迫切任务。;1、LASER分类;2、常见的LASER激发方式;3.1、CO2的成孔原理;　　固态Nd：YAG紫外激光器发射的是高能量的紫外光光束，利用其光学能(高能量 光子)，破坏了有机物的分子键(如共价键)，金属晶体(如金属键)等，形成悬浮颗粒 或原子团、分子团或原子、分子而逸散离出，最后形成盲孔。;4、常见LASER的加工材料;吸收率;Laser 钻孔简介;Aspect Ratio;我司现有 Laser 钻机 HITACHI 　　LC-1C21E/1C 　　LC-2F21SE/1C 　　LC-2F212SE/2C 　　LC-2G212E/2C 　　LC-2G212BE/2C SUMITOMO 　　LAVIA 1000TW ESI 　　5320 　　5330;ESI UV Laser对位系统1——内层靶标对位;15.7 mil Through Hole;1.对位标靶---圆形 2.对位补偿类似ESI ;Laser Beam;Copper surface is cleaned and ‘textured’;Laser 钻机介绍; Cycle Mode Burst Mode Step Mode;钻孔速度;一阶盲孔： A、CO2 laser drill B、CO2 laser direct drill C、UV direct drill D、UV+CO2 laser drill;Microvia制作工艺;五、Microvia 缺陷分析 ---缺陷类型 ---产生原因和影响 ---解决方法 ;(1)Under Cut; PROBLEMS Under Cut Delaminate Cause and Effect Heat accumulation from RCC copper surface Impact to the RCC surface by Laser Beam ; Solution Short pulse width Reduce the pulse energy; PROBLEMS Barrel Shaped Inner Hole Cause and Effect Reflection from hole bottom Incorrect position of Laser mode(single mode)to the hole ;Reflection; Solution Short pulse(less than less) The best suited number of shots Multi-mode Beam; PROBLEMS Remained Glass Fiber Cause and Effect Difference Nature against heat between resin and glass Solution High peak power processing Cycle-mode processing; PROBLEMS Remained Resin Cause and Effect a.Very thin smeared resin on the bottom of hole not reach sublimation point ;b. Unsuitability of resin thickness c. Single-mode processing ;d. Unsuitability of LASER pulse energy e. Incorrect position of LASER Beam ; PROBLEMS Micro Crack Cause and Effect The pressure from resin sublimation by LASER ;Solution -Short Pulse(less than less) -