晶圆切割开槽grove.docx

Applicati ons Example f Laser grooving kerf check function During blade dicing, when low-k or copper layers are present in the street, which are difficult to cut, usually blade dicing is performed after laser grooving. Adding the kerf check function can optimize this process. The kerf check can be performed relative to the width or position of the detected groove/kerf. Automatic kerf correction is also possible. .aer groovy a ran ■ ■ [Cw-k, ana Siikxxi Tape Conventional kerf check function The grooved area and the kerf are sometimes misrecognized. Laser grooving kerf check The laser groove and kerf are correctly function detected and recognized. Blade dbced ana[kerf) The kerf check can be performed relative to the width or position of the detected groove/kerf. Automatic kerf correction is also possible. -Kerf check function http://is01.disco.co.jP/psc/aphp.nsf/0/0CCCFA3F76C4BF4B49257272003AD540 -Low-k grooving http://www.disco.co.jp/eg/solution/library/low k.html This function can be installed as a user-specified specification. DISCO offers various kerf check methods for various applications. For details, please contact your DISCO sales representative. Low-k Grooving Makers employing Low-k material and copper in high-speed devices experience significant bottlenecks, as this material is difficult to blade-dice at standard speeds. Further, acceptable cut quality is hard to obtain. DISCOs engineers have developed an application that solves these issues. Applicati on Laser groov ing process First, the DFL7160 rapidly makes two laser grooves in the dicing street - either Pi Laser Grooving or Omega Laser Grooving; then the wafer is blade-diced at standard speed. This application achieves excellent throughput yet greatly reduces or eliminates chipping, delamination and other cut-quality issues. Pi ( n Pi ( n ) laser grooving (Step cut blade dicing) Omega ( 3 ) laser grooving (One pass blade dicing) Street Width■Lo\二 | Street Width ■ Lo\ 二 | — ■- — Metal Circuits v-k